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Mother Board PCB for E-PARALLAX-1013
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Mother Board PCB for E-PARALLAX-1013

Mother Board PCB for E-PARALLAX-1013

Overview

The Mother Board PCB for E-PARALLAX-1013 is a robust, high-efficiency control board tailored for mid-sized multi-head combination weighers. It acts as the central hub for data acquisition, signal conditioning, and actuator command execution, ensuring precise synchronization across all weighing heads of the E-PARALLAX-1013 system. Its modular structure and reinforced power handling design make it ideal for demanding, continuous-use industrial packaging environments.


Key Features

  • Dedicated Architecture: Optimized for the E-PARALLAX-1013 model.

  • High-Density Channel Distribution: Multiple identical processing circuits arranged in parallel, allowing simultaneous signal processing across multiple channels.

  • Enhanced Power Management: Includes large filtering capacitors and robust heat sinks for each power handling segment.

  • Modular Design: Clearly segmented circuit banks with independent transistor arrays for efficient thermal distribution and fault isolation.


Hardware Highlights

  • Power Section:

    • 2x Large Electrolytic Capacitors for ripple smoothing

    • Integrated heat sink and thermal pathways to dissipate operational heat

  • Signal Processing Arrays:

    • Rows of capacitors, resistors, and ICs for each weighing channel

    • Parallel configuration for independent channel performance and scaling

  • Connectivity:

    • Multi-pin industrial-grade header for board-to-board or controller interface

    • Orange terminal block for external power input

  • Mechanical Layout:

    • Five major thermal zones with dedicated black anodized aluminum heat sinks

    • Through-hole mounting for secure panel integration

$660.00

Original: $2,200.00

-70%
Mother Board PCB for E-PARALLAX-1013

$2,200.00

$660.00

Mother Board PCB for E-PARALLAX-1013

Overview

The Mother Board PCB for E-PARALLAX-1013 is a robust, high-efficiency control board tailored for mid-sized multi-head combination weighers. It acts as the central hub for data acquisition, signal conditioning, and actuator command execution, ensuring precise synchronization across all weighing heads of the E-PARALLAX-1013 system. Its modular structure and reinforced power handling design make it ideal for demanding, continuous-use industrial packaging environments.


Key Features

  • Dedicated Architecture: Optimized for the E-PARALLAX-1013 model.

  • High-Density Channel Distribution: Multiple identical processing circuits arranged in parallel, allowing simultaneous signal processing across multiple channels.

  • Enhanced Power Management: Includes large filtering capacitors and robust heat sinks for each power handling segment.

  • Modular Design: Clearly segmented circuit banks with independent transistor arrays for efficient thermal distribution and fault isolation.


Hardware Highlights

  • Power Section:

    • 2x Large Electrolytic Capacitors for ripple smoothing

    • Integrated heat sink and thermal pathways to dissipate operational heat

  • Signal Processing Arrays:

    • Rows of capacitors, resistors, and ICs for each weighing channel

    • Parallel configuration for independent channel performance and scaling

  • Connectivity:

    • Multi-pin industrial-grade header for board-to-board or controller interface

    • Orange terminal block for external power input

  • Mechanical Layout:

    • Five major thermal zones with dedicated black anodized aluminum heat sinks

    • Through-hole mounting for secure panel integration

Product Information

Shipping & Returns

Description

Overview

The Mother Board PCB for E-PARALLAX-1013 is a robust, high-efficiency control board tailored for mid-sized multi-head combination weighers. It acts as the central hub for data acquisition, signal conditioning, and actuator command execution, ensuring precise synchronization across all weighing heads of the E-PARALLAX-1013 system. Its modular structure and reinforced power handling design make it ideal for demanding, continuous-use industrial packaging environments.


Key Features

  • Dedicated Architecture: Optimized for the E-PARALLAX-1013 model.

  • High-Density Channel Distribution: Multiple identical processing circuits arranged in parallel, allowing simultaneous signal processing across multiple channels.

  • Enhanced Power Management: Includes large filtering capacitors and robust heat sinks for each power handling segment.

  • Modular Design: Clearly segmented circuit banks with independent transistor arrays for efficient thermal distribution and fault isolation.


Hardware Highlights

  • Power Section:

    • 2x Large Electrolytic Capacitors for ripple smoothing

    • Integrated heat sink and thermal pathways to dissipate operational heat

  • Signal Processing Arrays:

    • Rows of capacitors, resistors, and ICs for each weighing channel

    • Parallel configuration for independent channel performance and scaling

  • Connectivity:

    • Multi-pin industrial-grade header for board-to-board or controller interface

    • Orange terminal block for external power input

  • Mechanical Layout:

    • Five major thermal zones with dedicated black anodized aluminum heat sinks

    • Through-hole mounting for secure panel integration

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